AMIES
AMIES FEOL Laser Annealing
FEOL Laser Annealing for semiconductor and advanced packaging applications.
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Power Device Laser Annealing for semiconductor and advanced packaging applications.
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Specifications are reference information; available configurations, performance and lead time are confirmed in your quotation. Manufacturer reference information; supply scope and configuration confirmed on enquiry.
| Annealing depth | >7 µm |
|---|---|
| Thin-wafer handling | Down to 50 µm |
| Wafer bow | Up to 5 mm |
Final specifications are confirmed in the quotation. Ask a technical question ↗
Share your application, substrate and target specification.