Equipment & materials
Wafer Robots and Load Ports
Wafer-transfer modules and related equipment support.
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Configurable wafer handling with OCR, alignment and double-sided identification.
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Specifications are reference information; available configurations, performance and lead time are confirmed in your quotation.
| Wafer sizes | 6–12 inches |
|---|---|
| Load ports | Two |
| 150/200 mm wafer thickness | 180–750 µm |
| 150/200 mm warpage | ≤1 mm |
| 150/200 mm edge types | Notch and flat |
| 300 mm wafer thickness | 280–750 µm |
| 300 mm warpage | ≤3 mm |
| 300 mm edge type | Notch |
| Substrates | Single-/double-side polished wafers, glass, sapphire, GaAs, SiC and others |
Reference information: 2025-09. Final specifications are confirmed in the quotation. Ask a technical question ↗
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