AMIES FEOL Laser Annealing
FEOL Laser Annealing for semiconductor and advanced packaging applications.
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Manufacturer-stated development platform for compound semiconductor lithography. Confirm current product maturity and configuration.
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Manufacturer-stated development specifications. The brochure scheduled first-prototype acceptance for the second half of 2025; completed acceptance and current product maturity require confirmation. Manufacturer reference information; supply scope and configuration confirmed on enquiry.
| Resolution | 0.35 µm L/S |
|---|---|
| Machine-to-machine overlay | ≤40 nm |
| Substrate sizes | 2 / 3 / 4 / 6 / 8 inches |
Final specifications are confirmed in the quotation. Ask a technical question ↗
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