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AMIES FEOL Laser Annealing
FEOL Laser Annealing for semiconductor and advanced packaging applications.
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AMIES Advanced Packaging AOI
Advanced Packaging AOI for semiconductor and advanced packaging applications.
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Reference specifications.
Specifications are reference information; available configurations, performance and lead time are confirmed in your quotation. Manufacturer reference information; supply scope and configuration confirmed on enquiry.
| Options | 2D / 3D metrology; bump height; TSV depth; silicon thickness |
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