AMIES
AMIES FEOL Laser Annealing
FEOL Laser Annealing for semiconductor and advanced packaging applications.
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SWA / SWB Wafer Aligner and Bonder for semiconductor and advanced packaging applications.
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Specifications are reference information; available configurations, performance and lead time are confirmed in your quotation. Manufacturer reference information; supply scope and configuration confirmed on enquiry.
| Series | SWA alignment/bonding; SWB organic adhesive, glass frit and eutectic bonding |
|---|---|
| Substrate configurations | 8 / 12 inches |
Final specifications are confirmed in the quotation. Ask a technical question ↗
Share your application, substrate and target specification.