WEM2000 Maskless Wafer Writer
Maskless exposure for research, prototyping and small-batch wafer processing.
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Laser direct writing for photomasks, wafers and microfabrication applications.
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The reference values below describe the LP3000 exposure modes in the September 2025 product information. Each slash-separated value follows the exposure-mode order. Confirm the required configuration in your quotation.
| Imaging area | Up to 9 × 9 inches. |
|---|---|
| Exposure modes | 1st / 2nd / 3rd |
| Address grid | 10 / 30 / 50 nm |
| Minimum structure | 0.5 / 0.8 / 1.5 µm |
| Write speed | 27 / 50 / 220 mm²/min |
| Fast-mode write speed | 27 / 110 / 440 mm²/min |
| Edge roughness (3σ) | 50 / 70 / 110 nm |
| CD uniformity (3σ) | 50 / 80 / 120 nm |
| Alignment accuracy (3σ) | 70 / 100 / 200 nm |
Reference information: 2025-09. Final specifications are confirmed in the quotation. Ask a technical question ↗
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