YSD
LP3000 Direct-Write Lithography System
Laser direct writing for photomasks, wafers and microfabrication applications.
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Automatic mask alignment and exposure for 150 mm and 200 mm wafers.
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Specifications are reference information; available configurations, performance and lead time are confirmed in your quotation.
| Wafer sizes | 6 / 8 inches |
|---|---|
| Mask sizes | 7 / 9 inches |
| Wavelength | 365 / 405 nm UV LED |
| Light source | UV LED |
| Illumination | 40 mW/cm² |
| Illumination uniformity | >95% |
| Effective exposure range | 170 × 170 / 230 × 230 mm |
| Exposure modes | Hard contact / soft contact / proximity / vacuum contact |
| Exposure resolution | 0.35 µm |
| Wafer thickness | 0.4–1.6 mm |
| Alignment accuracy | ≤±0.1 µm |
Reference information: 2025-09. Final specifications are confirmed in the quotation. Ask a technical question ↗
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