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LP3000 Direct-Write Lithography System
Laser direct writing for photomasks, wafers and microfabrication applications.
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MOC / Lithography
MOC GA100 Manual Mask Aligner
Manual contact lithography with UV LED illumination for small substrates.
Configuration & availability confirmed on enquiry
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Product information
Reference specifications.
Specifications are reference information; available configurations, performance and lead time are confirmed in your quotation.
| Exposure type | Single-sided contact exposure |
|---|---|
| Exposure area | 105 × 105 mm |
| Illumination nonuniformity | ≤5% |
| Illumination intensity | 0–25 mW/cm²; higher intensity customizable |
| Wavelength | 405 / 365 nm; 405 nm default |
| Resolution | 2 µm |
| Overlay accuracy | 2 µm |
| Wafer size | ≤Ø102 mm |
| Substrate thickness | ≤5 mm |
| Mask size | ≤127 × 127 mm |
| Dimensions | 750 × 700 × 800 mm |
Reference information: 2025-09. Final specifications are confirmed in the quotation. Ask a technical question ↗
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